Applied Materials, Inc.
Ceramic hybrid insulator plate
Last updated:
Abstract:
The present disclosure generally relates to an electrostatic chuck for processing substrates. The electrostatic chuck includes a facilities plate and an insulator disposed between a cooling base and a ground plate. A support body is coupled to the cooling base for supporting a substrate thereon. A ring is configured to surround the insulator. The ring is formed from a material that is resistant to degradation from exposure to a manufacturing process. The ring optionally includes an extension configured to surround the facilities plate.
Status:
Grant
Type:
Utility
Filling date:
17 Jul 2018
Issue date:
15 Dec 2020