Applied Materials, Inc.
Ceramic hybrid insulator plate

Last updated:

Abstract:

The present disclosure generally relates to an electrostatic chuck for processing substrates. The electrostatic chuck includes a facilities plate and an insulator disposed between a cooling base and a ground plate. A support body is coupled to the cooling base for supporting a substrate thereon. A ring is configured to surround the insulator. The ring is formed from a material that is resistant to degradation from exposure to a manufacturing process. The ring optionally includes an extension configured to surround the facilities plate.

Status:
Grant
Type:

Utility

Filling date:

17 Jul 2018

Issue date:

15 Dec 2020