Applied Materials, Inc.
ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESS

Abstract:

Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches at a circumferential edge thereof. The electrostatic chuck also includes a plurality of lift pins corresponding to ones of the plurality of notches.