Applied Materials, Inc.
PHYSICAL VAPOR DEPOSITION OF PIEZOELECTRIC FILMS

Abstract:

A method of fabricating a piezoelectric layer includes depositing a piezoelectric material onto a substrate in a first crystallographic phase by physical vapor deposition while the substrate remains at a temperature below 400.degree. C., and thermally annealing the substrate at a temperature above 500.degree. C. to convert the piezoelectric material to a second crystallographic phase. The physical vapor deposition includes sputtering from a target in a plasma deposition chamber.