Applied Materials, Inc.
Methods To Grow Low Resistivity Metal Containing Films
Last updated:
Abstract:
The use of a cyclic 1,4-diene reducing agent with a metal precursor and a reactant to form metal-containing films are described. Methods of forming the metal-containing film comprises exposing a substrate surface to a metal precursor, a reducing agent and a reactant either simultaneously, partially simultaneously or separately and sequentially to form the metal-containing film.
Status:
Grant
Type:
Utility
Filling date:
29 Oct 2020
Issue date:
29 Apr 2021