Applied Materials, Inc.
EVAPORATOR CHAMBER FOR FORMING FILMS ON SUBSTRATES

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Abstract:

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.

Status:
Grant
Type:

Utility

Filling date:

8 Jul 2020

Issue date:

28 Jan 2021