Advanced Micro Devices, Inc.
SOLDERABILITY, OXIDATION, AND CORROSION INDICATOR FOR SEMICONDUCTOR PACKAGES

Abstract:

An indicator card for determining solderability, oxidation, corrosion and/or reliable operability of semiconductor packages stored in moisture barrier bags is disclosed. The indicator card may include a reactive metal-containing layer on a non-reactive substrate. The reactive metal-containing layer may react with a destructive gas (e.g., an oxidizing gas or corrosive gas) to provide a visual indication of the amount of exposure to the destructive gas has been encountered by a semiconductor package while the semiconductor package is stored in a moisture barrier bag. The visual indication may indicate to a user whether the amount of exposure is above or below an exposure threshold where the exposure threshold differentiates between acceptable and unacceptable levels of exposure related to solderability, oxidation, corrosion and/or reliable operability of the semiconductor package.