Advanced Micro Devices, Inc.
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME

Abstract:

Various arrangements of multi-RDL structure devices are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer structure and a second redistribution layer structure mounted on the first redistribution layer structure. A first semiconductor chip is mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure.