Advanced Micro Devices, Inc.
INTEGRATED CIRCUIT MODULE WITH INTEGRATED DISCRETE DEVICES

Abstract:

In at least one embodiment, an integrated circuit product includes a redistribution layer, an integrated circuit die disposed above the redistribution layer, and a discrete device disposed laterally with respect to the integrated circuit die and disposed above the redistribution layer. The integrated circuit product may include encapsulant mechanically coupling the redistribution layer, the integrated circuit die, and the discrete device. The integrated circuit product may include first conductive vias through the redistribution layer and second conductive vias through the redistribution layer. The first conductive vias may be electrically coupled to the integrated circuit die and the second conductive vias being electrically coupled to the discrete device. The discrete device may include a discrete capacitor device made from a ceramic material, electrolytic materials, or electrochemical materials.