Advanced Micro Devices, Inc.
METHOD AND APPARATUS FOR POWER DELIVERY TO A DIE STACK VIA A HEAT SPREADER

Abstract:

Various chip stack power delivery circuits are disclosed. In one aspect, an apparatus is provided that includes a stack of semiconductor chips that has an uppermost semiconductor chip and a lowermost semiconductor chip. A heat spreader is positioned on the uppermost semiconductor chip. A power transfer circuit is configured to transfer electric power from the heat spreader to the uppermost semiconductor chip.