Advanced Micro Devices, Inc.
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS

Abstract:

A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.