Advanced Micro Devices, Inc.
SEPARATING TEMPERATURE DOMAINS IN COOLED SYSTEMS

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Abstract:

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.

Status:
Application
Type:

Utility

Filling date:

30 Oct 2020

Issue date:

5 May 2022