Advanced Micro Devices, Inc.
Integrated heat spreader with configurable heat fins

Abstract:

Various integrated heat spreaders and methods of making the same are disclosed. In one aspect, an integrated heat spreader to provide thermal management of a first heat generating component on a circuit board is provided. The integrated heat spreader includes a shell that has an internal space, at least one inlet port to receive a coolant to cool the first heat generating component and at least one outlet port to discharge the coolant. Plural heat fins are connected to the shell in the internal space. The heat fins are selectively connectable to the shell in multiple arrangements to provide selected flow rates of the coolant in one or more regions of the internal space.