Advanced Micro Devices, Inc.
Integrated thermoelectric cooler for three-dimensional stacked Dram and temperature-inverted cores

Abstract:

Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.