Amazon.com, Inc.
System and method for a system-in-package using EMI shielding for capacitive touch sensing

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Abstract:

Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.

Status:
Grant
Type:

Utility

Filling date:

24 Nov 2020

Issue date:

28 Jun 2022