Arista Networks, Inc.
Landing pattern for ball grid array

Abstract:

A printed circuit board for a surface mount device (SMD) is provided. The printed circuit board includes adjacent, opposed first and second lands on a face of the printed circuit board, the first land comprising a first solder pad contacting or merged with a first annular pad of a first via, the second land comprising a second solder pad contacting or merged with a second annular pad of a second via, arranged for solder mounting a surface mount device to the first and second solder pads.