ANSYS, Inc.
Integrated Circuit Composite Test Generation
Last updated:
Abstract:
A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of M, states using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering M.sup.N8j combinations. Related apparatus, systems, techniques and articles are also described.
Status:
Application
Type:
Utility
Filling date:
16 Jun 2021
Issue date:
11 Nov 2021