ANSYS, Inc.
Dynamic thermal management simulation using improved reduced order modeling

Abstract:

Methods and systems are described that improve simulations which use thermal models to test dynamic thermal mitigation of devices, such as smartphones. These methods and systems can use a thermal Reduced Order Model (ROM) that is trained through machine learning to provide efficient systems that can significantly reduce the time and computational resources required to build a simulation of a device's thermal behavior. The thermal model can be used in different usage scenarios with different power management and thermal management controls to test the device's thermal behavior.