ANSYS, Inc.
Parasitic representation of large scale IC packages and boards
Last updated:
Abstract:
Improved parasitic analysis of a design of an electrical circuit (e.g. a PCB coupled to an IC package) can use a first parasitic analysis to identify a first set of pins having excessive parasitic values ("hotspots" in the design) and then identify a second set of pins that do not have excessive parasitic values. The pins in the second set can be clustered (e.g. using a grid of cells) to reduce a model size for calculations in a second parasitic analysis, and the pins in the first set can be analyzed in the second parasitic analysis either individually or in clusters of similar pins with excessive parasitic values.
Status:
Grant
Type:
Utility
Filling date:
6 Jan 2021
Issue date:
7 Jun 2022