ASML Holding N.V.
Method for determining a control parameter for an apparatus utilized in a semiconductor manufacturing process

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Abstract:

A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data. Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.

Status:
Grant
Type:

Utility

Filling date:

30 Jul 2018

Issue date:

23 Nov 2021