ASML Holding N.V.
Device manufacturing method

Last updated:

Abstract:

A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.

Status:
Grant
Type:

Utility

Filling date:

28 Mar 2018

Issue date:

13 Jul 2021