ASML Holding N.V.
Substrates and methods of using those substrates
Last updated:
Abstract:
A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.
Status:
Grant
Type:
Utility
Filling date:
1 May 2018
Issue date:
25 May 2021