ASML Holding N.V.
Substrates and methods of using those substrates

Last updated:

Abstract:

A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.

Status:
Grant
Type:

Utility

Filling date:

1 May 2018

Issue date:

25 May 2021