ASML Holding N.V.
Method for determining an optimized set of measurement locations for measurement of a parameter of a lithographic process, metrology system and computer program products for implementing such methods

Abstract:

A method, and associated system, for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a semiconductor manufacturing process. The method includes determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between the first set of parameter values and the second set of parameter values and used to determine the optimized set of measurement locations.