The Boeing Company
Audio instrument with three-dimensional localization

Abstract:

An audio instrument includes a component assembly, a pan-tilt mechanism, and one or more processors. The component assembly includes a parabolic reflector, an audio device, and a sensor unit. The audio device is configured to one or more of receive or transmit sound waves via a transducer element disposed within a communication envelope of the parabolic reflector. The sensor unit includes a distance measurement sensor. The pan-tilt mechanism orients the component assembly at independent angular rotations about two orthogonal axes relative to a support platform. The one or more processors are configured to control the pan-tilt mechanism to orient the component assembly such that a central axis of the parabolic reflector is aimed towards a specific three-dimensional location for targeted audio communication between the audio device and a target at the specific three-dimensional location.