The Boeing Company
Apparatuses and methods to prevent or minimize the effect of voids in bonded systems

Abstract:

Methods, apparatuses, and systems are disclosed for manufacturing a structure having layers that may operate in low pressure or vacuum environments. More particularly, methods, apparatuses, and systems are disclosed for minimizing the effects of voids by eliminating their contents in layers of bonded structures. In some implementations, a method for improving bonding within a layered structure comprises applying a bonding material layer to a substrate layer; disposing a wicking material in the bonding material layer, said wicking material having an outer surface; applying a surface material layer to the bonding material layer to form a layered structure; and curing the layered structure.