The Boeing Company
Systems and methods for viscous material vacuum deaeration, and systems and methods for depositing compounds in a structure

Abstract:

Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel or other structure are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin (under the compound, within the void) during the repair. Additionally or alternatively, presently disclosed systems and methods for deaerating a compound are configured to remove trapped air from the compound prior to use of the compound (e.g., prior to depositing the compound within a void for repairing the void). In some examples, the same system is configured to both deaerate the compound and deposit the deaerated compound to the void, all while in a reduced air pressure environment inside a vacuum chamber.