The Boeing Company
Apparatus, system, and method for picking, placing, and melting solder sleeves onto shielded electrical wires and cables

Abstract:

Systems and methods are provided for wire processing. In certain examples, a wire processing system is disclosed. The wire processing system includes an electrical wire and solder sleeve joining system. The electrical wire and solder sleeve joining system includes an end effector configured to hold a solder sleeve and a split funnel configured to guide insertion of wire into the solder sleeve, allow movement of the solder sleeve through the split funnel in a second position, and prevent movement of the solder sleeve through the split funnel in a first position. The end effector can additionally be configured to remove a slug from the wire.