The Boeing Company
Optical imaging and scanning of holes

Abstract:

Methods and apparatus for optical imaging and scanning of holes machined, drilled or otherwise formed in a substrate made of composite or metallic material. The method utilizes an optical instrument for imaging and scanning a hole in combination with an image processor configured (e.g., programmed) to post-process the image data to generate one complete planarized image without conical optical distortion. The optical instrument includes an optical microscope with confocal illumination and a conical mirror axially positioned to produce a full 360-degree sub-image with conical distortion. In the post-processing step, a mathematical transformation in the form of computer-executable code is used to transform the raw conical sub-images to planar sub-images. The planarized sub-images may be stitched together to form a complete planarized image of the hole.