The Boeing Company
Form Board Preparation for Wire Bundling
Last updated:
Abstract:
Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
Status:
Application
Type:
Utility
Filling date:
28 Oct 2019
Issue date:
29 Apr 2021