Becton, Dickinson and Company
LASER ASSEMBLY

Abstract:

Laser assemblies are provided. Aspects of the laser assemblies according to certain embodiments include a laser, a thermoelectric cooler in contact with a bottom surface of the laser and a heat dissipation component in contact with a bottom surface of the thermoelectric cooler. Optical decks having a substrate and a laser assembly, e.g. as described above, are also provided. Methods and systems for irradiating a sample in a flow stream with the laser assembly are also provided. Aspects further include kits having a diode laser, a thermoelectric cooler and a heat dissipation component.