Butterfly Network, Inc.
CMOS ultrasonic transducers and related apparatus and methods

Last updated:

Abstract:

CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

Status:
Grant
Type:

Utility

Filling date:

11 Jan 2018

Issue date:

31 Dec 2019