Benchmark Electronics, Inc.
Thermal management system and method therefor

Last updated:

Abstract:

A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.

Status:
Grant
Type:

Utility

Filling date:

9 Jun 2020

Issue date:

2 Aug 2022