Benchmark Electronics, Inc.
THERMAL MANAGEMENT SYSTEM AND METHOD THEREFOR

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Abstract:

A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.

Status:
Application
Type:

Utility

Filling date:

9 Jun 2020

Issue date:

15 Apr 2021