Camtek Ltd.
Hierarchical wafer inspection

Abstract:

There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.