CMC Materials, Inc.
UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
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Abstract:
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.
Status:
Application
Type:
Utility
Filling date:
18 Oct 2021
Issue date:
21 Apr 2022