Cadence Design Systems, Inc.
System and method for power-grid aware simulation of an IC-package schematic

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Abstract:

Embodiments include herein are directed towards a method for use in an electronic design environment is provided. The method may include providing, using at least one processor, an electronic circuit design including an integrated circuit ("IC") or package schematic and generating a power distribution network ("PDN") based upon at least in part, the electronic circuit design including the IC or package. The method may further include obtaining a PDN model having one or more port mappings between one or more layout terminals and one or more schematic pin-names and stitching the PDN model and the IC or package schematic into a combined PDN and IC or package schematic model. The method may also include simulating the combined PDN and IC or package schematic model using the at least one processor.

Status:
Grant
Type:

Utility

Filling date:

12 Dec 2018

Issue date:

22 Sep 2020