Cadence Design Systems, Inc.
System, method and computer program product for design rule awareness associated with die and package electronic circuit co-design
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Abstract:
The present disclosure relates to a computer-implemented method for electronic circuit design awareness. Embodiments may include providing, using a processor, an electronic design having a package layout and a die layout associated therewith. Embodiments may also include displaying at a graphical user interface, the package layout and allowing, at the graphical user interface, a user to edit the package layout. Embodiments may further include determining, using the processor, an impact of the edit on the die layout and in response to the edit, mirroring the edit at the die layout.
Status:
Grant
Type:
Utility
Filling date:
19 Dec 2017
Issue date:
5 May 2020