Ciena Corporation
Managing stray light absorption in integrated photonics devices

Last updated:

Abstract:

Fabricating a photonic integrated circuit includes fabricating structures in one or more silicon layers. At least a first silicon layer comprises: one or more photonic structures, where the photonic structures include one or more waveguides and one or more photodetectors, and one or more light absorbing structures, where at least some of the light absorbing structures include doped silicon. Fabricating the photonic integrated circuit also includes fabricating at least one waveguide in the photonic integrated circuit for receiving light into at least one of the silicon layers.

Status:
Grant
Type:

Utility

Filling date:

14 Jan 2020

Issue date:

4 Jan 2022