Ciena Corporation
Resonant device improvement in PICs using spare devices to reduce power requirements

Abstract:

A Photonic Integrated Circuit (PIC) includes N Ring and Disk type Microstructures (RDMs), N is an integer and greater than 1; at least one spare RDM, wherein each RDM operates spectrally in a periodic nature and has its spectral operation vary by temperature; and circuitry configured to handoff any of the N RDMs and the at least one spare RDM for spectral operation based on a current temperature. For the handoff, the at least one spare RDM is unlocked spectrally and is tuned and locked to a frequency of interest of a current RDM based on the temperature, and the current RDM is unlocked.