Ciena Corporation
Systems and methods for increasing granularity and fan-out of electric circuits with co-packaged optical interfaces

Abstract:

Systems and methods increase the fan-out (radix) of optical connections that are co-packaged with electric circuits, e.g., Application-Specific Integrated Circuits (ASICs). Optical or electrical techniques are presented to break out multiple data streams from a Photonic Integrated Circuit (PIC) integrated with an ASIC. This provides the ability to increase the I/O capability (radix) of an ASIC, allowing the ASIC to connect to a larger number of devices (e.g., servers). A cross-connect system includes one or more cross-connect devices optically interconnected to 1) a plurality of switches with each switch connected to one or more subtending servers, and 2) a plurality of switch circuits having Photonic Integrated Circuits (PICs) integrated therewith, each of the one or more cross-connect devices is configured to provide fan-out of the plurality of switches between the plurality of switch circuits to increase a number of the subtending servers.