Cree, Inc.
Radio Frequency Package Implementing a Window Frame with Edge Plating and Processes of Implementing the Same

Abstract:

A radio frequency (RF) package includes a support having a semiconductor die attach region; a frame that includes an electrically insulative member having a lower side attached to the support and an upper side opposite the support; the frame includes an opening at least partially registered with said semiconductor die attach region; and the frame includes an upper metallization at the upper side of the electrically insulative member and a lower metallization The frame includes first electrically conductive edge connection connecting the first metallization to the first lower metallization.