Cree, Inc.
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING MULTI-LAYER ENCAPSULATIONS THAT INCLUDE FUNCTIONAL ELECTRICAL CIRCUITS

Abstract:

RF transistor amplifiers are provided that include a submount and an RF transistor amplifier die that is mounted on top of the submount. A multi-layer encapsulation is formed that at least partially covers the RF transistor amplifier die. The multi-layer encapsulation includes a first dielectric layer and a first conductive layer, where the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer.