Cree, Inc.
PASSIVATION STRUCTURES FOR SEMICONDUCTOR DEVICES

Abstract:

Semiconductor devices, and more particularly passivation structures for semiconductor devices are disclosed. A semiconductor device may include an active region, an edge termination region that is arranged along a perimeter of the active region, and a passivation structure that may form a die seal along the edge termination region. The passivation structure may include a number of passivation layers in an arrangement that improves mechanical strength and adhesion of the passivation structure along the edge termination region. An interface formed by at least one of the passivation layers may be provided with a pattern that serves to more evenly distribute forces related to thermal expansion and contraction during power cycling, thereby reducing cracking and delamination in the passivation structure. A patterned layer may be at least partially embedded in the passivation structure in an arrangement that forms the corresponding pattern in overlying portions of the passivation structure.