Cree, Inc.
DEVICE PACKAGES WITH UNIFORM COMPONENTS AND METHODS OF FORMING THE SAME

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Abstract:

A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.

Status:
Application
Type:

Utility

Filling date:

5 Feb 2021

Issue date:

11 Aug 2022