Cree, Inc.
POWER SEMICONDUCTOR DEVICE WITH REDUCED STRAIN
Last updated:
Abstract:
Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.
Status:
Application
Type:
Utility
Filling date:
17 Feb 2021
Issue date:
18 Aug 2022