Cree, Inc.
POWER SEMICONDUCTOR DEVICE WITH REDUCED STRAIN

Last updated:

Abstract:

Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.

Status:
Application
Type:

Utility

Filling date:

17 Feb 2021

Issue date:

18 Aug 2022