Cisco Systems, Inc.
Connection features for electronic and optical packaging

Last updated:

Abstract:

An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.

Status:
Grant
Type:

Utility

Filling date:

19 Aug 2019

Issue date:

4 Jan 2022