Cisco Systems, Inc.
Connection features for electronic and optical packaging
Last updated:
Abstract:
An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.
Status:
Grant
Type:
Utility
Filling date:
19 Aug 2019
Issue date:
4 Jan 2022