Cisco Systems, Inc.
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane

Last updated:

Abstract:

A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.

Status:
Grant
Type:

Utility

Filling date:

28 Aug 2020

Issue date:

14 Dec 2021