Cisco Systems, Inc.
Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment

Abstract:

An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.