Cisco Systems, Inc.
Fiber weave skew assessment for printed circuit boards

Last updated:

Abstract:

In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.

Status:
Grant
Type:

Utility

Filling date:

6 May 2020

Issue date:

5 Apr 2022