Cisco Systems, Inc.
Fiber weave skew assessment for printed circuit boards
Last updated:
Abstract:
In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
Status:
Grant
Type:
Utility
Filling date:
6 May 2020
Issue date:
5 Apr 2022