Cisco Systems, Inc.
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
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Abstract:
A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
Status:
Grant
Type:
Utility
Filling date:
26 Oct 2020
Issue date:
10 May 2022