Cisco Systems, Inc.
Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits

Abstract:

In one embodiment, an apparatus includes a cold plate comprising a first side and a second side, a photonic integrated circuit connected to a substrate positioned on the second side of the cold plate, and an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal between the photonic integrated circuit and the first side of the cold plate.